𐄀 Technology Connection to Future
As AI technology continues to advance, the power consumption of high-performance computing hardware continues to rise. Liquid cooling has evolved from an optimization option for data centers into an essential foundation for the stable operation of large-scale computing clusters. As a critical link in the liquid cooling loop, fluid connectors play a direct role in system reliability, integration, and maintenance efficiency, all of which are essential to maximizing the performance of AI computing platforms. Designed for next-generation high-density AI computing racks, Yonggui MQD Series Liquid Cooling Quick Disconnects combine a compact design, reliable sealing, and convenient maintenance to provide dependable fluid connections for large-scale AI data centers.
MQD (manual mating) and MQDB (blind mating) fluid connectors are dedicated components developed for liquid cooling loops in next-generation high-density AI data centers. Unlike standard connectors designed for general liquid cooling applications, the series focuses on fluid connections within servers, between cold plates and manifolds, and across racks, with the core design goal of delivering high flow performance in a compact form factor.
MQD features a manual push-to-lock design for quick connection and disconnection. MQDB, designed for blind mating, enables direct connection without visual alignment, making it suitable for automated and modular rack deployment while reducing maintenance time in high-density racks. Together, the two solutions cover diverse liquid cooling connection requirements for high-density computing racks and provide reliable fluid connectivity for the stable operation of high-power AI hardware.
With equivalent flow performance, the MQD/MQDB Series is approximately 40% smaller than the general-purpose UQD/UQDB Series. Available in models including MQD-3 and MQD-4, the series delivers Kv flow coefficients of up to 0.583 m³/h and 0.91 m³/h, respectively, with a maximum operating flow rate of 6.81 L/min.
Combining a compact form factor with high flow capacity, the series is well suited for space-constrained installation inside servers, significantly improving rack space utilization and meeting the layout requirements of next-generation high-density AI computing racks.
Featuring a face seal and bidirectional shut-off valve design, the connectors provide reliable sealing in both connected and disconnected states, effectively preventing coolant leakage. The push-to-lock mechanism enables quick one-handed connection, locking, and disconnection, with a maximum mating force of <63 N for easy operation. Red and blue markings clearly distinguish the coolant inlet and outlet, helping prevent incorrect connections and simplifying on-site inspection and maintenance. The MQDB blind-mate version enables connection without visual alignment, making it suitable for automated and modular deployment while further reducing maintenance time.
With a pressure rating of ≥1.6 MPa and a minimum burst pressure of ≥4.8 MPa, the series provides a sufficient safety margin and supports up to 5,000 mating cycles. Designed for a wide operating temperature range of −55°C to +125°C, the connectors also withstand ≥168 hours of salt spray and 240 hours of cyclic damp heat. The series meets GJB360B-2009 vibration and shock test requirements, with no leakage under pressure. The housing, rear nut, and spring are made of passivated stainless steel, while JE-EPDM seals provide resistance to media corrosion and aging.
Available in MQD-3 and MQD-4 sizes to accommodate different flow requirements, the series supports customizable rear interfaces and is compatible with mainstream cooling media, including ethylene glycol, propylene glycol coolant, and deionized water. The products can be integrated with piping assemblies, manifolds, cold plates, CDUs, and other components, supporting complete cold-plate liquid cooling architectures and meeting diverse customization requirements for AI data center projects.
In response to the rapid development of AI data centers, Yonggui continues to build a comprehensive liquid cooling portfolio covering piping assemblies, manifolds, liquid cooling connectors, cold plates, and optical module assemblies. This enables integrated liquid cooling interconnect solutions for high-density computing applications. Yonggui has comprehensive in-house manufacturing and reliability validation capabilities, supported by precision machining and brazing equipment as well as systematic reliability testing platforms. Key components are developed and manufactured in-house, with closed-loop quality control covering raw materials, processing and assembly, and final product delivery to support large-volume requirements for hyperscale AI data centers.
Looking ahead, Yonggui will continue to advance liquid cooling interconnect technologies, expand its product portfolio, and strengthen customization capabilities to support the evolving needs of AI computing infrastructure.
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